Advanced chip packaging is one of Intel’s (INTC) quietly fast-growing businesses. Over the past six months, Intel has been signaling that its advanced packaging business, which operates within the Foundry chip-making arm of the company, is having a growth spurt, Wired reports. The company’s efforts around this have it going head-to-head with TSMC (TSM), which far surpasses Intel’s production in terms of scale. But Intel thinks this effort can help it grab a bigger slice of the AI pie. Multiple sources say that Intel has been in ongoing talks with at least two large customers for its advanced packaging services, namely Google (GOOGL) and Amazon (AMZN), which both make their own custom chips but outsource parts of the fabrication process, Wired adds.
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